Araldite 2014-2 (previously 2014-1) is a gap filling, room temperature curing adhesive, producing very little out gassing, making it ideal for electronics, telecommunication and aerospace applications.
With a high temperature resistance of up to 120°C and excellent resistance to water and chemicals, this adhesive provides a good bond to a wide variety of substrates.
Used for bonding of metals, electronic components, GRP structures and many other items where a higher than normal temperature or more aggressive environment is to be encountered in service.
*Araldite 2014-2 is a direct replacement for Araldite 2014-1
Araldite 2014-1 has been withdrawn due to environment, health & safety reasons. Araldite 2014-2 is more user-friendly, safer & sustainable.